TSMC to build four new fabs in Central Taiwan, aiming for 2nm wafer production by 2028
TSMC will start building four new fabs in Central Taiwan this year, targeting mass production of 2nm semiconductor wafers by late 2028, according to Central Taiwan Science Park Bureau.
- TSMC to begin construction of four new fabs in Central Taiwan by late 2025.
- Fab 25 will focus on 2nm wafer production, with mass output set for late 2028.
- The first plant aims for 50,000 wafers per month following a 2027 risk assessment.
- TSMC also expanding in the US with a US$165 billion investment including six fabs in Arizona.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) will begin constructing four new wafer fabrication plants in Central Taiwan later this year.
The move aims to support mass production of 2-nanometre (nm) semiconductor wafers by the end of 2028.
The announcement was made on 19 July 2025 by Central Taiwan Science Park Bureau director-general Hsu Maw-shin during a ceremony marking the park’s 22nd anniversary.
Hsu stated that the development represents the second phase of the Central Taiwan Science Park’s expansion.
This phase will begin with the construction of water detention ponds and other soil and water conservation infrastructure.
According to Hsu, TSMC has already leased the necessary land, which was officially handed over by the Science Park in June.
The four upcoming plants will be designated as Fab 25 and are part of TSMC’s 1.4nm process roadmap, which builds on the company’s previously revealed A14 fabrication plans.
The first plant under Fab 25 is scheduled to complete risk assessment procedures in 2027.
TSMC projects it will begin mass production of 2nm wafers by late 2028, with a targeted monthly output of 50,000 wafers.
According to Hsu, the park’s annual turnover could exceed NT$1.2 trillion (approximately US$40.81 billion), setting a new record.
The roadmap was initially revealed at the North America Technology Symposium held in California on 25 April 2025.
The symposium featured several key developments, including updates on TSMC’s advanced node plans.
TSMC chairman C.C. Wei also elaborated on the company’s global strategy during its second-quarter earnings call on 18 July.
Wei said that approximately 30 percent of TSMC’s 2nm and more advanced production capacity would be located in Arizona, United States.
The company is investing US$165 billion in the US to establish a comprehensive manufacturing ecosystem.
This includes six advanced wafer manufacturing facilities, two advanced packaging fabs, and a major research and development centre.
Wei noted that the goal is to create a robust, independent semiconductor manufacturing cluster in the US.
Back in Taiwan, TSMC is preparing additional 2nm fab phases at both the Hsinchu and Kaohsiung science parks.
These developments are intended to meet increasing customer demand for advanced nodes.
Furthermore, Wei confirmed that the company intends to construct 11 new wafer manufacturing facilities and four advanced packaging plants globally in the coming years.
The planned expansion aligns with TSMC’s long-term goal to lead in high-end semiconductor manufacturing amid growing geopolitical and market shifts.
This effort is seen as crucial for securing the supply of chips essential to AI, automotive, and next-generation computing technologies.
The Central Taiwan Science Park, already a hub for several major technology firms, is positioned to become a pivotal location for advanced semiconductor production.
The success of the Fab 25 initiative could significantly enhance Taiwan’s role in the global chip supply chain.
